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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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ETX 3.0 Specification Released - Adding Serial ATA to ETX
Kontron Innovates ETX with True Long Term Support and 100% Compatibility
Eching, Germany, March 22th, 2006 - Kontron, a leading embedded computer technology company, today announced the release of the ETX 3.0 specification for computer-on-modules (COMs). The new specification brings in 2x Serial ATA without changing any of the ETX pins, making new modules 100 percent pin-to-pin compatible with previous versions and ensuring long-term support for the vast number of embedded application solutions based on these already highly integrated COMs including medical, gaming and entertainment, military and aerospace, etc.
ETX 3.0 modules, such as the Kontron's ETX-LX, integrate 2x Serial ATA via two slim line connectors that are designed onto the top-side of the CPU module itself rather than requiring the ETX-connectors of the module and carrier board to be redefined. As a result, existing carrier board designs can remain unmodified in order for the solution to take advantage of faster Serial ATA hard drives. ETX 3.0 also defines USB 2.0 to be used via the existing ETX connectors.
Kontron along with ADLINK, MSC and other supporting members of the ETX Industrial Group (www.etx-ig.org) have adopted ETX 3.0 with the intention of keeping the standard viable until at least 2010. Additional modules built around dual-core processors and others from Intel®, AMD®, and VIA® are planned for release over the course of the year with more to follow.
To obtain a copy of the ETX 3.0 specification, contact a local Kontron office and/or visit the ETX Industrial Group website (www.etx-ig.org). A downloadable version of the specification will be available in the near term future.
ETX and ETXexpress
Computer-On-Modules such as ETX and, most recently, ETXexpress (based on COM Express) are implemented in embedded systems tailored to meet customer needs. The advantages: concentration on core competences, fast time to market, low design risk and freely scalable performance. ETX modules with PCI bus are geared toward applications with low to medium performance. High-end applications are implemented with PCI Express bus-based ETXexpress modules. In the future, the standard ETX will also undergo further development in scalability and performance, because PCI will be used in embedded systems for just as long as the older ISA bus used today.
