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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Intel® Honors Kontron's Multi-core Commitment
Kontron Honored with "2007 Multi-Core Alignment Award of Excellence" for its Continued Development of Multi-core Platforms
SCOTTSDALE, ARIZONA/SAN DIEGO, November 2, 2007 Kontron was honored for its continued commitment to the development of multi-core platforms during the Intel Communications Alliance (ICA) Executive Summit on Wednesday October 24th in Scottsdale, Arizona. Intel selected Kontron to receive its 2007 Multi-core Alignment Award of Excellence in the Alliance Hardware Member category.
The honor was awarded to Kontron for having the largest number and breadth of multi-core products based on Intel technology as measured by listings in the Intel ICA Solutions Directory.
To be awarded the 2007 Multi-Core Alignment Award of Excellence reinforces Kontrons commitment to developing innovative embedded computing platforms with the latest multi-core advances, said Hannes Niederhauser, CEO of Kontron AG. Ultimately, what our customers value is our ability to provide the form factors and system platforms that they require with the processing capabilities they need.
Kontron has designed the most comprehensive portfolio of multi-core platforms, with over 30 products in a wide range of form factors and system platforms. Kontrons solid relationship with Intel as Premier member of the Intel Communications Alliance allows Kontron to develop its computing platforms in parallel with Intels development of its processors; making platforms with the newest processing advances available as soon as the latest evolution of multi-core processors are. This means that Kontron customers can deliver their applications to market faster.
Kontrons customers reap the benefit of its leading edge design strategies. By providing customers with the processing power that they want, Kontron embedded computing platforms enable efficient execution of the processing demands of todays compute-intensive applications.
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About Kontron
Kontron designs and manufactures standard-based and custom embedded and communication solutions for OEMs, systems integrators, and application providers in a variety of markets. Kontron engineering and manufacturing facilities, located throughout Europe, North America, and Asia-Pacific, work together with streamlined global sales and support services to help customers reduce their time-to-market and gain a competitive advantage. Kontrons diverse product portfolio includes: Computer-on-Modules, SBCs/blades, open-modular platforms and systems, HMIs, and custom capabilities. Kontron is a Premier member of the Intel® Communications Alliance and was awarded 2006 Intel Member of the Year. The company is a recent three-time VDC Platinum vendor for Embedded Computer Boards. Kontron is listed on the German TecDAX stock exchange under the symbol "KBC". For more information, please visit: www.kontron.com.
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Editor Contact
Richard Pugnier
Manager, Marketing Communications
Kontron
858.623.3006
richard.pugnier@us.kontron.com
