Performance boost and greater flexibility through unified cross platform middleware and FPGA based I/O design services
Eching, Germany, January 5, 2011 – Parallel to the launch of the 2nd generation Intel® Core™ processors, Kontron announced that it will be supporting this advanced new microarchitecture with CPU, processor graphics, memory controller (some with ECC support) and PCIe controller on a single die on over 10 embedded platforms. The 2nd generation Intel® Core™ i3/i5/i7 processors have a completely new microarchitecture, enabling small-sized designs to be created with unmatched computing power, graphics performance and energy efficiency on a small footprint*. In addition, with Kontron’s value-added middleware, and strength in offering market-specific I/Os via FPGA, even more specific applications can be custom-tailored.
The first Kontron product to feature this highly integrated processor with improved graphics performance is the Kontron COM Express™ basic ETXexpress®- SC Computer-on-Module. In Q1 2011, a mini-ITX, Flex-ATX embedded motherboard and 6U CompactPCI® blade will follow. Other platforms planned for 2011 include 3U CompactPCI®, 3U VPX, AdvancedMC™, PCIe/104™, ATX embedded motherboards, several industrial PCs.
"With our new COM Express™ Module ETXexpress®-SC and all other upcoming platforms, customers are able to create very energy-efficient high-performance applications directly with the availability of this new processor generation," says Dirk Finstel, CTO at Kontron. "On top of this, we support them with our cross platform middleware, Kontron EAPI (Kontron Embedded Application Programming Interface), that offers a highly efficient I/O access and application migration to reduce engineers R&D efforts and time to market for the next generation applications. Our service doesn’t stop at this unique feature set either. Additionally, we also offer extensive custom design services as well as migration support that include validation and verification. The goal of all those value adding features to this amazing new processor is to drive customers’ R&D costs and time-to-market down to a minimum."
"The improvements inherent in the 2nd generation Intel® Core™ processor family allow customers to enhance performance, as well as save money through reduced bill of materials (BOM) and by increasing design reuse over time," says Matt Langman, director of product marketing, Embedded Computing Division, Intel. "I/O flexibility is offered through up to twenty PCIe lanes, and architectural changes have improved the performance while reducing power consumption."
In addition to extended scalability, optimized power consumption and improved graphics performance, target applications will benefit from the new processors’ high-level of integration, including the memory controller (some with ECC support) and processor graphics. Kontron’s platforms based on 2nd generation Intel® Core™ processors will also incorporate Intel® Advanced Vector Extensions (Intel® AVX) to accelerate scalar-based operations required for imaging applications in industrial automation, medical and military. Intel® AVX also accelerates intensive floating-point applications, such as high-performance embedded computing (HPEC). Additionally, Intel® Turbo Boost Technology 2.0 automatically shifts or reallocates processor cores and processor graphics resources to speed up performance, tailoring a workload to give users an immediate performance boost whenever possible based on thermal headroom. Since OEMs can use these enhancements on a wide Kontron portfolio of standardized and proven platforms, design risks are minimized and quality rises. Furthermore, R&D cost savings and reduced time-to-market are accomplished through Kontron’s unified cross platform middleware, Kontron EAPI, which is included in all new Kontron boards and systems with the 2nd generation of Intel® Core i3/i5/i7 processors.
Visit the product page for the Kontron COM Express™ basic ETXexpress®-SC Computer-on-Module:
Kontron’s white paper on the 2nd generation of Intel®’ Core™ processor family:
*22% reduced footprint compared to the previous generation of Intel® Core™ i3/i5/i7 BGA processors.