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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Product Comparison
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| COMe-mBT10 | |
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COM Express® mini Type 10 with Intel® Atom® E3800 & Celeron® Series |
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| Compliance | COM Express® mini, Pin-out Type 10 |
| Dimension (H x W) | 84 x 55 mm |
| CPU | COMe-mBTi10: Intel® Atom® E3845 (4x1.91GHz, 10W) Intel® Atom® E3827 (2x1.75GHz, 8W) Intel® Atom® E3826 (2x1.46GHz, 7W) Intel® Atom® E3825 (2x1.33GHz, 6W) Intel® Atom® E3815 (1x1.46GHz, 5W) COMe-mBTc10: Intel® Celeron® J1900 (4x2.00GHz, 10W) Intel® Celeron® N2930 (4x1.83GHz, 7.5W) Intel® Celeron® N2807 (2x1.58GHz, 4.5W) Intel® Atom™ E3815 (1x1.46GHz, 5W) |
| Chipset | - |
| Main Memory | up to 4GB DDR3L-1066/1333 memory down (ECC optional) |
| Graphics Controller | Intel® HD Graphics (Gen7) |
| Ethernet Controller | COMe-mBTi10: Intel® I210IT COMe-mBTc10: Intel® I210AT (I211AT) |
| Ethernet | 10/100/1000 MBit Ethernet |
| Storage | 2x SATA 3Gb/s |
| Flash Onboard | Build option: - up to 84 GByte eMMC pSLC - up to 256 GByte eMMC TLC |
| PCI Express | 3x PCIe x1 |
| Display | DDI: DP++ LVDS: Single Channel 18/24bit or eDP |
| USB | 1x USB 3.0 (incl. USB 2.0) 3x USB 2.0 from CPU or 2x USB 2.0 from CPU + 4x USB 2.0 via Hub (34006 only) |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS |
| Special Features | POSCAP capacitors GPIO/SDIO Switch General Purpose SPI optional |
| Options | 1x PCIe x1 additional w/o onboard LAN Trusted Platform Module TPM 1.2 ECC memory eMMC Flash option (up to 84GB pSLC, 256GB TLC) eDP instead of LVDS General Purpose SPI instead of Boot SPI |
| Power Management | ACPI, S5 Eco |
| Power Supply | 4.75V – 20V Wide Range, Single Supply Power |
| BIOS | Phoenix Secure Core UEFI |
| Operating System | Windows® 8, Windows® 7, Linux, VxWorks |
| Temperature | Commercial temperature (COMe-mBTc10): 0°C to +60°C operating -30°C to +85°C non-operating Industrial temperature (COMe-mBTi10): -40°C to +85°C operating -40°C to +85°C non-operating |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | 34006-xxxx-xx-x: COMe-mBTi10, industrial temperature 34007-xxxx-xx-x: COMe-mBTc10, commercial temperature |
