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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Product Comparison
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| COMe-cBTi6R | |
| COM Express® compact Type 6 with Intel® Atom™ E3800 Series | |
| Compliance | COM Express® compact, Pin-out Type 6 |
| Dimensions (H x W x D) | 95 x 95 mm |
| CPU | Intel® Atom™ E3845 (4x1.91GHz, 10W) |
| Chipset | Integrated SoC |
| Main Memory | 2x DDR3L-1333 ECC memory down up to 4GB or 2x DDR3L-1333 memory down up to 8GB |
| Graphics Controller | Intel® HD Graphics (Gen7) |
| Ethernet Controller | USB SMSC LAN7500i or PCIe Intel® I210IT |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | 2x SATA 3Gb/s |
| Flash Onboard | 2 - 64GB eMMC 1x microSD Socket |
| Panel signal | DDI1: DP++ DDI2: DP++ (shared w/LVDS) DDI3: - VGA: Yes LVDS: Dual Channel 18/24bit |
| PCI Express / PCI support | 4x PCIe Gen 2.0 w/USB LAN 3x PCIe Gen 2.0 w/PCIe LAN (optional) |
| USB | 1x USB 3.0 (incl. USB 2.0) 2x USB 2.0 from CPU 4x USB 2.0 from HSIC Hub |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS |
| BIOS | Phoenix Secure Core UEFI |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Options | ECC or non-ECC memory eMMC Flash onboard (2-32GB SLC, 4-64GB MLC) microSD Socket PCIe GBEthernet AES-NI |
| Power Management | ACPI, S5 Eco Kontron Rapid Shutdown |
| Power Supply | 4.75V – 20V Wide Range, Single Supply Power |
| Special Features | POSCAP capacitors GPIO/SDIO Switch LVDS/DP Multiplexer 2x MIPI-CSI on PEG interface |
| Operating System | Windows® 8, Windows® 7, WE8S, WES7, WEC7, Linux, VxWorks |
| Temperature | Industrial temperature: # -40°C to +85°C operating, -40°C to +85°C non-operating |
| Supported Modules | 36016-xxxx-xx-x: COMe-cBTi6R |
