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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Product Comparison
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| COMe-cSL6 | |
| COM Express® compact Type 6 with 6th Generation Intel® Core™ Processors | |
| Compliance | COM Express compact Pin-out Type 6 |
| Dimensions (H x W x D) | 95 x 95 mm |
| CPU | Intel® Core™ i7-6600U, 2x 2.60 GHz, GT3, 15 W Intel® Core™ i5-6300U, 2x 2.40 GHz, GT3, 15 W Intel® Core™ i3-6100U, 2x 2.30 GHz, GT2, 15 W Intel® Celeron® Processor 3955U, 2x 2.0 GHz, GT1, 15W |
| Chipset | Integrated SoC |
| Main Memory | Up to 8GB DDR4 memory down & up to 16GB DDR4 SODIMM |
| Graphics Controller | Intel® HD Graphics 520 (Celeron® 3955U: Intel® HD Graphics 510) |
| Ethernet Controller | Intel® I219LM |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | 2x SATA 6Gb/s |
| Flash Onboard | up to 64 GByte SLC eMMC 5.0 (depending on SKU - standard feature or available on request) |
| PCI Express / PCI support | 5x PCIE3.0 (5 controllers, 5 x1, 1 x4 + 1 x1) Option: 6 Lanes if no LAN 4x PCIE3.0 on PEG Lanes 0-3 (1 controller, 1 x4 or 1 x2 or 1 x1) |
| Panel signal | DDI1: DP++, DDI2: DP++, DDI3: -, VGA: -, LVDS: Dual Channel 18/24 bit |
| USB | 4x USB 3.0/2.0, + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| BIOS | AMI UEFI, vPRO optional |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Additional | on request: 1x PCIe x1 additional w/o onboard LAN, eDP, max 64 GByte eMMC, instead of LVDS, vPRO (AMT/TXT/AES Support), industrial grade -40 °C to +85 °C |
| Power Management | ACPI 4.0, S5 Eco |
| Power Supply | 8.5 V – 20 V Wide Range ATX, Single Supply Power |
| Special Features | Trusted Platfom Module TPM 2.0, Security Chip, POSCAP capacitors |
| Operating System | WES7, WES8, W7, W8, Linux, VxWorks |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating On request Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating |
| Supported Modules | COMe-cSL6, commercial temperature |
