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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Product Comparison
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| COMe-bBL6 | |
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COM Express® basic Type 6 with 5th Generation Intel® Core™ Processors |
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| Compliance | COM Express® basic, Pin-out Type 6 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Core™ i7-5850EQ, Intel® Core™ i7-5700EQ, Intel® Xeon® E3-1278L v4, Intel® Xeon® E3-1258L v4 |
| Chipset | Intel® Mobile QM87 |
| Main Memory | 2x non-ECC DDR3L-1600 SO-DIMM up to 2x 16 GByte |
| Graphics Controller | Intel® Iris™ Pro Graphics P6300/6200 (GT3e), Intel® HD Graphics P5700/P5600 (GT2) |
| Ethernet Controller | Intel® I218LM |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | QM87: 3x SATA 6Gb/s, 1x SATA 3Gb/s |
| Flash | - |
| PCI Express / PCI support | 7x PCIe x1, 1x PEG x16 |
| Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: Yes, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS |
| BIOS | Phoenix Secure Core UEFI |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Options | 1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/AES Support), eDP instead of LVDS |
| Power Management | ACPI 4.0, S5 Eco |
| Power Management | ACPI 4.0, S5 Eco |
| Special Features | POSCAP capacitors, Trusted Platfom Module TPM 1.2, 4k Resolutions, Flexible PEG lane confi guration by Setup Option |
| Operating System | Windows® 10, Windows® 8, Windows® 7, WE8S, WES7, Linux, VxWorks |
| Temperature | Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating on COMe-bBL6XT Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating on COMe-bBL6 |
