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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Product Comparison
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| COMe Eval Carrier T6 | |
| COM Express® Evaluation Carrier Type 6 | |
| Compliance | COM Express® Rev. 2.0 Pin-out Type 6 |
| Dimensions (H x W x D) | 305 x 244 mm (ATX) |
| Supported Modules | COM Express® basic or compact with pin-out Type 6 |
| Graphics | 1x LVDS/JILI FFC 40 connector 1x VGA 2x DP++ (DDI2/DDI3) 1x PEG x16 for discrete Graphics |
| Hard Disk | 4x SATA 1x micro-SD |
| USB | 4x USB 3.0 2x USB 2.0 |
| PCI Express / PCI support | 1x PEG x16 slot 1x PCIe x16 (electrically x4) 2x PCIe x1 1x miniPCIe (with USB) 1x Express Card (with USB) |
| Audio | Realtek ALC888 HD-Audio S/PDIF in/out 7.1 audio jacks |
| Ethernet | 1x 10/100/1000 MBit RJ 45 connector |
| Serial | 2x UART on pin-header (from module) |
| Special Features | 1x PWM Fan from COM 2x FAN from Carrier HWM SPI and LPC boot |
| Common Features | Port80 POST Code Display Diagnostic LED PWR/RST Buttons |
| Options | Carrier EEPROM |
| Power Supply | ATX power supply 24+4pin |
| Temperature | Operation: 0° to 60°C Storage: -30° to 85°C |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
