COBALT 901 New

Reduced SWAP - Rugged Embedded Computer
Specifications
  • Small Form Factor 8.5" (216mm) x 5.5" (140mm) x 3.9" (99mm)
  • Intel® Core™ i7 processor options via COM Express® Type 6
  • Rugged, IP67 Sealed System
  • Configurable Front Panel for Modular I/O Profi le Options
  • Supports XMC and mPCIe modules
  • Extended Temperature -40ºC to +71ºC
  • No ITAR restrictions
Download Datasheet

The highly scalable COBALT product family is based on the COMe module Basic & Compact form factor module (Type 6) with a specialized carrier board assembly. It is available with a wide selection of power, interface options, thermal solutions, and mounting kits. The compact footprint and power-to-performance optimization make it the ideal solution for applications requiring high performance, reduced size-weight-power in an environmentally ruggedized platform. The design flexibility ensures fast time-to-market for many applications in the following segments: military, avionics, commercial avionics, mining, smart grid, homeland security, transportation (rail), and oil & gas.

Downloads

Datasheets

Cobalt 901
The highly scalable COBALT product family is based on the COMe module Basic & Compact form factor module (Type 6) with a specialized carrier board assembly. It is available with a wide selection of power, interface options, thermal solutions, and mounting kits. The compact footprint and power-to-performance optimization make it the ideal solution for applications requiring high performance, reduced size-weight-power in an environmentally ruggedized platform. The design flexibility ensures fast time-to-market for many applications in the following segments: military, avionics, commercial avionics,mining, smart grid, homeland security, transportation (rail), and oil & gas.
[ datasheet_cobalt-901.pdf, 0.96 mb, 2015/06/10 ]

Manuals

Cobalt 901 User Manual [restrictions apply]
The highly scalable COBALT product family is based on the COMe module Basic & Compact form factor module (Type 6) with a specialized carrier board assembly. It is available with a wide selection of power, interface options, thermal solutions, and mounting kits. The compact footprint and power-to-performance optimization make it the ideal solution for applications requiring high performance, reduced size-weight-power in an environmentally ruggedized platform.
[ 78500901_um_0.2.pdf, 2.59 mb, 2014/10/21 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 0.37 mb, 2015/11/19 ]



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