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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Contract Manufacturer consolidation finalized!
Augsburg, Germany, July 22, 2015 – Kontron, a leading global provider of Embedded Computer Technology (ECT), is pleased to announce that the contract manufacturer portfolio consolidation from previously 23 contract manufacturers down to 5 strategic contract manufacturers has been completed. This measure was one key target within the comprehensive efficiency program “New Kontron” that was introduced in 2013 by the CEO Rolf Schwirz. Within the last two fiscal years Kontron reduced steadily the historically grown number of its contract manufacturers to finally achieve its target to work with 5 Contract Manufacturers. Bernhard Braunmueller, Chief Operating Officer at Kontron, expresses his satisfaction with the result: “We decided to drastically reduce the number of suppliers in the field of production services in order to develop strategic partnerships with a much smaller number of selected suppliers which are all long-standing business partners. This has also helped us to significantly reduce operational complexity, to bundle contract manufacturing volumes and to achieve better delivery flexibility.”
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