embedded world 2018: Kontron presents Computer-on-Modules, Embedded computers and servers for IoT-, Fog- and Cloud computing

embedded world 2018: Kontron presents Computer-on-Modules, Embedded computers and servers for IoT-, Fog- and Cloud computing

Highlights: KBox-C Fog computer TSN / OPC UA enabled - Embedded Server Cube with Intel® Xeon® processors available - newest Intel® as well as AMD and NXP processors in several products – new Q7 COM form factor

Augsburg, Germany, December 14, 2017 – Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), will present a range of new products at the embedded world 2018 trade fair from February 27th to March 1st 2018 in Nuremberg, Germany, in hall 1, booth 478: a Fog computing starter kit with a TSN networking card for getting started with Time Sensitive Networking (IEEE 802.1) and OPC UA publisher, FusionClient familiy and FlatClient family panel PCs, and a new Embedded Server ZINC “Cube” comprising the latest Intel® processors. In addition, Computer-on-Modules, motherboards and single board computers of various price categories and performance classes with the latest Intel, AMD and NXP processors will be presented. Kontron will also unveil the latest Computer-On-Module form factor Q7 in addition to COM Express® and SMARC 2.0™.

Visitors of embedded world 2018 can learn more about how Kontron, together with the S&T group, supports companies in their digitization and IoT strategies down to the field level with the latest technology, products and services. The trade fair presence’s highlight is a Time Sensitive Networking starter kit. It enables companies to seamlessly connect the field level, operational technology (OT) and information technology (IT). The starter kit consists of a KBox C-102 as the industrial computer for the central control through the integrated TSN networking card and the appropriate software.

TSN demonstration with Embedded Cloud components at the booth 
Kontron presents a Embedded Cloud live demo based on a TSN system and OPC UA connected to various IoT and TSN devices such as an Embedded server at embedded world. 

The TSN specification guarantees the timely, high-availability delivery of data packets. In industrial environments, such as machine control applications in production, convergent, Ethernet-based TSN with guaranteed latency and Quality of Service (QoS) with time synchronization can replace proprietary fieldbus systems and seamlessly communicate through to the IT layer. This makes real IIoT or Industry 4.0 based on Ethernet protocol standards possible.

Embedded server with Intel Xeon processor
Tailored for its Embedded Cloud vision and Edge- and Fog computing, Kontron presents its first available Embedded server: the successor of the “Cube” evaluation platform already unveiled with a Single Intel Xeon processor in a compact, cost-optimized design with extended storage functionality.

HMI with touch control for industrial applications
In manufacturing lines and production plants, the trend is towards touch controlled visual user interfaces to control machines and systems. To withstand the rough conditions in industrial settings, Kontron offers two product families of industrial-suited HMI: FusionClient and FlatClient. Both families are on display at embedded world, equipped with the latest generation of Intel® Core™ i7 processors.

New IOT gateways based on Single-Board-Computer (SBC)
The latest KBox A-250 based on a PicoITX-2.5”-SBC comes equipped with the latest Intel Atom® processors. Its favorable price makes it especially well-suited for use as an entry IoT gateway and at low interface demand.

New from Kontron: Computer-on-modules with Q7 form factor
At embedded world Kontron will present for the first time ever, Computer-on-modules with a Q7 form factor, which be will offered alongside the COM Express® and SMARC 2.0™ form factors going forward. These modules are already available with NXP i.MX and Intel Atom processors for SMARC. With its new Q7 form factor products, Kontron addresses customers using products of this format already, opening a migration path to the SMARC 2.0 standard.

Notification for media professionals
Find out about the Kontron trade fair attendance highlights, latest products as well as current strategy- and technology announcements at the embedded world press conference on the first day of the trade fair, Tuesday, February 27th 2018, at 16.00 pm in room Hongkong (NCC Ost, level 1). We kindly ask you to register via our agency Vibrio via email to kontron@vibrio.de, phone +49 (0)89 32151 760.

Please note that the scope for individual questions and answers is limited at the press conference. Please arrange a personal meeting with Kontron experts in due course at kontron@vibrio.de, phone +49 (0)89 32151 760.

A seperate Kontron media session at embedded world invitation will follow.




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About Kontron – An S&T Company

Kontron is a global leader in IoT/embedded computing technology (ECT). As a part of technology group S&T, Kontron offers a combined portfolio of secure hardware, middleware and services for Internet of Things (IoT) and Industry 4.0 applications. With its standard products and tailor-made solutions based on highly reliable state-of-the-art embedded technologies, Kontron provides secure and innovative applications for a variety of industries. As a result, customers benefit from accelerated time-to-market, reduced total cost of ownership, product longevity and the best fully integrated applications overall.

For more information, please visit: www.kontron.com




For further information please contact:

Alexandra Habekost
Head of Investor Relations & Corporate Communications
Kontron S&T AG
Tel: +49 (0) 821 4086 114



All rights reserved. Kontron is a trademark or registered trademark of Kontron S&T AG. Intel® and Intel® CoreT are trademarks or registered trademarks of Intel® Corporation in the US and other countries. PICMG® and COM Express® are trademarks or registered trademarks of the PCI Industrial Computers Manufacturers Group. SMARC TM  is a trademark of the SGET e.V. (Standardization Group for Embedded Technologies e.V.). All other brand or product names are trademarks or registered trademarks or copyrights by their respective owners and are recognized. All data is for information purposes only and not guaranteed for legal purposes. Subject to change without notice. Information in this press release has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies.

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